---
title: "2027 Packaging Engineer at Texas… – New Taipei, Taiwan"
canonical: "https://www.metaintro.com/job/2027-packaging-engineer-at-texas-instruments-8dc38895-5f17-5078-bdcd-21ccd046366a"
language: "en"
author: "Metaintro"
---

[/company/texas-instruments](/company/texas-instruments)[Texas Instruments](/company/texas-instruments)
# 2027 Packaging Engineer at Texas Instruments

Department: Packaging EngineeringEducation: Bachelor's Degree

LanguageEnglish
中文

**Location**
: New Taipei

**Type**
: Full-time

**Level**
: entry

**Posted**
: Sep 18, 2026

## Description

TI is hiring a Packaging Engineer to design, develop, and analyze semiconductor packaging technologies for analog and embedded processing products. The role partners with business and cross-functional teams on packaging solutions, product qualification, production, reliability, yield, design testability, and test coverage; leads design-of-experiments and material supplier collaboration; and develops electrical, mechanical, and thermal models. The position requires a bachelor's degree in a specified engineering or science field and a cumulative GPA of 3.0 or higher, with semiconductor packaging knowledge and analytical skills preferred. TI does not sponsor visas or work authorization for this position.

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