---
title: "Advanced Packaging Module… at Intel – Hillsboro, OR"
canonical: "https://www.metaintro.com/job/advanced-packaging-module-development-engineer-at-intel-0d4bc82b-584f-5dfd-b324-d18586d8d814"
language: "en"
author: "Metaintro"
---

[/company/intel](/company/intel)[Intel](/company/intel)
# Advanced Packaging Module Development Engineer at Intel

Compensation · Listed in posting

$133,800 – $255,200/yr

**Location**
: Hillsboro, Oregon

**Type**
: Full-time

**Level**
: senior

**Posted**
: Sep 25, 2026

## Description

Intel is hiring a Process Integration Engineer for its Hillsboro, Oregon semiconductor campus. The role leads manufacturing process design, technology development, pathfinding, equipment optimization, supplier collaboration, feasibility studies, and data-driven process improvement using SPC, DOE, robotics, automation, vision systems, and image processing. Candidates need a relevant master's degree with 4+ years of experience or a PhD with 3+ years of experience, along with semiconductor processing or automation expertise. The position is on-site and offers an annual salary range of $133,800 to $255,200 USD.

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