---
title: "Advanced Packaging Process Engineer at Intel – Phoenix, AZ"
canonical: "https://www.metaintro.com/job/advanced-packaging-process-engineer-at-intel-9b3b91f9-df9d-5673-a9a9-26aaf0f3d496"
language: "en"
author: "Metaintro"
---

[/company/intel](/company/intel)[Intel](/company/intel)
# Advanced Packaging Process Engineer at Intel

Compensation · Listed in posting

$115,110 – $219,550/yr

**Location**
: Phoenix, Arizona

**Type**
: Full-time

**Level**
: mid

**Posted**
: Oct 2, 2026

## Description

Intel is hiring a Packaging Module Development Engineer for its Advanced Packaging Technology Manufacturing organization. The role develops, optimizes, and qualifies semiconductor packaging processes and equipment; designs experiments using SPC and DOE; collaborates with engineering, manufacturing, and product development teams; establishes materials and equipment specifications; documents technical findings; and leads standardization across global sites. The position requires an on-site presence in Phoenix, Arizona, offers a target annual salary of $115,110 to $219,550 USD, and is not eligible for immigration sponsorship.

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