---
title: "Advanced Packaging Top Die… at Intel – Albuquerque, NM"
canonical: "https://www.metaintro.com/job/advanced-packaging-top-die-module-engineer-at-intel-e0251afc-9446-503e-a602-19dbdaae7830"
language: "en"
author: "Metaintro"
---

[/company/intel](/company/intel)[Intel](/company/intel)
# Advanced Packaging Top Die Module Engineer at Intel

Compensation · Listed in posting

$103,730 – $198,820/yr

**Location**
: Albuquerque, New Mexico

**Type**
: Full-time

**Level**
: mid

**Posted**
: Sep 21, 2026

## Description

Intel is hiring a Module Engineer to operate and optimize high-volume semiconductor manufacturing equipment and processes, conduct metrology and process characterization, perform maintenance and upgrades, lead continuous improvement and excursion-prevention initiatives, support technology transfer, and qualify equipment during factory ramps. The role requires a STEM bachelor's degree and 4+ years of relevant experience, or equivalent experience with a master's or PhD, and is based on-site in Albuquerque, New Mexico, with an annual salary range of $103,730 to $198,820 USD.

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