---
title: "CUF TD Module Engineer at Intel – Kulim, Malaysia"
canonical: "https://www.metaintro.com/job/cuf-td-module-engineer-at-intel-cee396fb-120e-5804-a05e-94ef72f4dcd2"
language: "en"
author: "Metaintro"
---

[/company/intel](/company/intel)[Intel](/company/intel)
# CUF TD Module Engineer at Intel

**Location**
: Kulim, Kedah

**Type**
: Full-time

**Level**
: mid

**Posted**
: Aug 4, 2026

## Description

Intel is hiring an experienced packaging assembly process engineer in Kulim, Malaysia. The role develops and improves capillary underfill (CUF) module assembly processes and equipment for semiconductor packaging, optimizes manufacturing quality, reliability, cost, yield, productivity, and manufacturability, and leads qualification, reliability, supplier, and process-improvement activities using experiments, statistical methods, and data analysis. The position requires regular onsite presence and generally prefers a master's or doctoral engineering or physics degree with at least three years of experience, while considering bachelor's degree holders with strong relevant experience.

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