---
title: "ElectroMechanical… at Lockheed Martin – Orlando, FL +1"
canonical: "https://www.metaintro.com/job/electromechanical-packaging-engineer-hardware-protection-focus-at-aa1c84c3-3c68-5422-ba3c-2d6bc84a85f3"
language: "en"
author: "Metaintro"
---

[/company/lockheed-martin](/company/lockheed-martin)[Lockheed Martin](/company/lockheed-martin)
# ElectroMechanical Packaging Engineer (Hardware Protection Focus) at Lockheed Martin

Department: MFC-Primary

Compensation

$158,700 – $294,700/yr

**Setup**
: Hybrid

**Location**
: Orlando, Florida · Grand Prairie, Texas

**Type**
: Full-time

**Level**
: senior

**Posted**
: Sep 9, 2026

## Description

Lockheed Martin is hiring an Electro Mechanical Engineer for its Hardware Engineering team in Orlando, Florida. The role owns the design, qualification, reliability, failure analysis, and production support of 3D heterogeneous integration packages, including thermal management, mechanical survivability, circuit-card and interconnect design, multiphysics simulations, and design assurance. The position requires a STEM degree or 15 years of related experience, U.S. citizenship, and the ability to obtain a DoD Secret clearance. The full-time salary range is $158,700 to $294,700, with medical, dental, vision, flexible work arrangements, and other benefits.

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