---
title: "ENGINEER, PACKAGE DEVELOPMENT… at Micron – Sgurgola, Italy"
canonical: "https://www.metaintro.com/job/engineer-package-development-engineering-package-silicon-integration-be539eea-8c24-5594-bb05-12ba9570ee36"
language: "en"
author: "Metaintro"
---

[/company/micron](/company/micron)[Micron](/company/micron)
# ENGINEER, PACKAGE DEVELOPMENT ENGINEERING, PACKAGE SILICON INTEGRATION at Micron

Department: Assembly & Test

LanguageEnglish
Italiano

**Setup**
: On-site

**Location**
: Sgurgola, Lazio

**Level**
: entry

**Posted**
: Jun 11, 2026

## Description

Micron is hiring an early-career Engineer, Package–Silicon Integration to support NAND package and silicon integration for next-generation memory products. The role involves chip-package interaction assessments, package design and assembly investigations, DFMEA/PFMEA activities, yield and quality issue investigations, test vehicles and design-of-experiments support, technical documentation, and cross-functional collaboration with silicon, wafer fabrication, package design, assembly, R&D, and manufacturing teams. The position requires a bachelor’s or master’s degree in engineering and less than two years of relevant experience, with guidance and mentoring provided.

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