---
title: "Foveros Direct Pathfinding… at Intel – Hillsboro, OR +1"
canonical: "https://www.metaintro.com/job/foveros-direct-pathfinding-integration-at-intel-25e767bb-3974-5325-84d0-1d8460564ccd"
language: "en"
author: "Metaintro"
---

[/company/intel](/company/intel)[Intel](/company/intel)
# Foveros Direct Pathfinding Integration at Intel

Compensation

$141,910 – $269,100/yr

**Location**
: Hillsboro, Oregon · Phoenix, Arizona

**Type**
: Full-time

**Level**
: senior

**Posted**
: Apr 15, 2026

## Description

Intel is hiring a Packaging Engineer to design, develop, and qualify packaging solutions and materials for semiconductor products. The role manages packaging development from artwork and concepts through prototypes, qualification testing, specification documentation, manufacturing startup, and benchmarking, while coordinating with manufacturing, regulatory, logistics, supply chain, vendor, and cross-functional partners. Candidates need a bachelor's, master's, or PhD in a relevant engineering or science field plus 4–6 years of relevant experience, along with expertise in packaging engineering, process development, semiconductor packaging design, and material certification. The position is an experienced hire requiring on-site work in Hillsboro, Oregon, or Phoenix, Arizona, with an annual salary range of $141,910 to $269,100 USD.

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