---
title: "IC Packaging Integration… at Apple – San Francisco, CA"
canonical: "https://www.metaintro.com/job/ic-packaging-integration-engineer-at-apple-7187c979-4e88-5bfe-8a38-12405ea197bd"
language: "en"
author: "Metaintro"
---

[![Apple logo](/api/favicon-proxy?url=https%3A%2F%2Fwww.google.com%2Fs2%2Ffavicons%3Fdomain%3Dwww.apple.com%26sz%3D128)](/company/apple)[Apple](/company/apple)
# IC Packaging Integration Engineer at Apple

Department: Hardware

Compensation · Listed in posting

$184,700 – $324,800

**Location**
: San Francisco, California

**Level**
: lead/mgmt

**Posted**
: Jul 24, 2026

## Description

Apple is hiring an IC Packaging Engineering Lead to lead package integration and architecture, co-design packages with silicon, packaging, and systems teams, develop advanced packaging technologies, and drive solutions from concept through qualification and high-volume production. The role involves cross-functional collaboration with assembly partners and third-party or OSAT suppliers, with 5–10% travel. Minimum qualifications include a bachelor's degree and at least 10 years of relevant industry experience; an MS or PhD and 6+ years of experience are preferred.

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