---
title: "Senior Packaging… at NVIDIA USA – Santa Clara, CA +1"
canonical: "https://www.metaintro.com/job/senior-packaging-technical-engineer-hardware-at-nvidia-usa-0e078aa1-03fd-5e43-a4e6-93fd239a8683"
language: "en"
author: "Metaintro"
---

[/company/nvidia-usa](/company/nvidia-usa)[NVIDIA USA](/company/nvidia-usa)
# Senior Packaging Technical Engineer - Hardware at NVIDIA USA

Compensation · Listed in posting

$168,000 – $258,750/yr

**Location**
: Santa Clara, California · Texas

**Type**
: Full-time

**Level**
: senior

**Posted**
: Aug 18, 2026

## Description

NVIDIA is hiring a Package Engineer to define and implement chip pad rings, substrate interconnect schemes, floor plans, and ball-outs, and to lead package layout design. The role collaborates with circuit, signal integrity, RTL, place-and-route, substrate layout, and system design teams. Candidates need a BSEE or equivalent and at least 8 years of board or system design experience; package design, transmission-line theory, power delivery, signal integrity, and scripting skills are preferred. The base salary is 168,000–258,750 USD for Level 4 and 200,000–322,000 USD for Level 5, with equity and benefits available. Applications were accepted until August 22, 2026.

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