---
title: "Sr Advanced Packaging… at Micron – Taichung, Taiwan"
canonical: "https://www.metaintro.com/job/sr-advanced-packaging-technology-development-engineer-film-process-at-9a36a068-104e-5886-8cd9-7f41ea8f0e93"
language: "en"
author: "Metaintro"
---

[/company/micron](/company/micron)[Micron](/company/micron)
# Sr Advanced Packaging Technology Development Engineer, FILM process at Micron

Department: HIG

LanguageEnglish
中文

**Setup**
: On-site

**Location**
: Taichung

**Level**
: mid

**Posted**
: Aug 27, 2026

## Description

Micron Technology is seeking an Advanced Packaging Process Engineer to drive HBM process development and yield improvement in FILMs processes, support advanced packaging research and development, execute on-site projects, troubleshoot complex process issues, and perform root-cause analysis. The role also involves materials characterization, test structure and vehicle design, supplier discussions, and technical reporting. Candidates need a master's degree or higher in a chemistry, physics, materials, or engineering science field, at least three years of FILMs experience involving CVD or PVD, thin-film deposition knowledge, and fluency in English and Chinese.

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