---
title: "Staff IC Packaging Engineer - Mechanical… – San Diego, CA"
canonical: "https://www.metaintro.com/job/staff-ic-packaging-engineer-mechanical-simulation-at-qualcomm-2ffed2a2-20e2-5c35-ac10-3a8c455f25af"
language: "en"
author: "Metaintro"
---

[/company/qualcomm-international-inc-mexico-branch-office](/company/qualcomm-international-inc-mexico-branch-office)[Qualcomm International Inc., Mexico Branch Office](/company/qualcomm-international-inc-mexico-branch-office)
# Staff IC Packaging Engineer - Mechanical Simulation at Qualcomm International Inc., Mexico Branch Office

Department: Packaging Engineering

Compensation

$160,200 – $240,200/yr

**Setup**
: On-site

**Location**
: San Diego, California

**Type**
: Full-time

**Level**
: senior

**Posted**
: Sep 17, 2026

## Description

Qualcomm is hiring an IC Packaging FEA Engineer to support current and future chipsets through mechanical finite-element analysis, warpage and stress analysis, solder-joint reliability prediction, package-assembly simulation, chip-package interaction analysis, and failure prediction. The role develops and maintains ANSYS APDL and Workbench models, establishes benchmarking and test-correlation methodologies, performs material characterization, and collaborates with design, NPI, and chip-package interaction teams. Candidates need a bachelor's, master's, or PhD in a relevant engineering field plus the stated years of experience, with semiconductor packaging and ANSYS experience preferred.

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