---
title: "Substrate/Package Layout Engineer at broadcom – San Jose, CA"
canonical: "https://www.metaintro.com/job/substrate-package-layout-engineer-at-broadcom-f18c9451-872d-5f44-91ae-dfa32c7bb5fa"
language: "en"
author: "Metaintro"
---

[/company/broadcom-4c962ebe](/company/broadcom-4c962ebe)[broadcom](/company/broadcom-4c962ebe)
# Substrate/Package Layout Engineer at broadcom

Compensation · Listed in posting

$141,300 – $226,000/yr

**Location**
: San Jose, California

**Type**
: Full-time

**Level**
: senior

**Posted**
: Apr 20, 2026

## Description

Broadcom OSD is hiring an IC Substrate and Package/Interposer Layout Engineer to design and layout advanced substrates and IC packages, develop script-based layout tools, perform DRC and LVS checks, collaborate with design and verification teams, and evaluate fabricated parts. The role requires extensive experience with Cadence and EDA tools, multilayer high-speed RF design, package and substrate manufacturing, and surface mount technology. The annual base salary is $141,300 to $226,000, with discretionary bonus, equity, and medical, dental, and vision benefits.

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