---
title: "Substrate Packaging Research… at Intel – Phoenix, AZ"
canonical: "https://www.metaintro.com/job/substrate-packaging-research-and-development-engineer-at-intel-1cffc509-ebe7-5afa-8c5c-5ebb1383a34c"
language: "en"
author: "Metaintro"
---

[/company/intel](/company/intel)[Intel](/company/intel)
# Substrate Packaging Research and Development Engineer at Intel

Compensation · Listed in posting

$133,800 – $188,890/yr

**Setup**
: Hybrid

**Location**
: Phoenix, Arizona

**Type**
: Full-time

**Level**
: senior

**Posted**
: Sep 28, 2026

## Description

Intel is hiring a Packaging Module Development Engineer to develop and optimize advanced semiconductor packaging processes, materials, and equipment for high-volume manufacturing. The role involves designing process specifications and workflows, conducting design of experiments, improving process capability and productivity, collaborating with cross-functional teams, establishing material specifications, and supporting equipment and process health. The position is based in Phoenix, Arizona, with a hybrid work model, and offers an annual salary range of $133,800 to $188,890 USD.

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