---
title: "Thin Films Module Development… at Intel – Hillsboro, OR"
canonical: "https://www.metaintro.com/job/thin-films-module-development-engineer-at-intel-0401cb8e-ad53-5052-9146-1481376d5d64"
language: "en"
author: "Metaintro"
---

[/company/intel](/company/intel)[Intel](/company/intel)
# Thin Films Module Development Engineer at Intel

Compensation · Listed in posting

$133,800 – $188,890/yr

**Location**
: Hillsboro, Oregon

**Type**
: Full-time

**Level**
: senior

**Posted**
: Aug 21, 2026

## Description

Intel is hiring a Thin Films Metals Module Development Engineer for its Technology Development organization to develop, define, optimize, and validate thin-film metal deposition processes for high-k/metal gate, contact, and interconnect applications. The role covers ALD, CVD, PVD, electrochemical deposition, process screening, equipment qualification, materials characterization, device validation, and cross-functional technology development. It requires a STEM PhD and at least one year of thin-film deposition experience, is based in Hillsboro, Oregon, and requires on-site availability for manufacturing operations.

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