Description
TI is hiring a Packaging Engineer to design, develop, and analyze semiconductor packaging technologies for analog and embedded processing products. The role partners with business and cross-functional teams on packaging solutions, product qualification, production, reliability, yield, design testability, and test coverage; leads design-of-experiments and material supplier collaboration; and develops electrical, mechanical, and thermal models. The position requires a bachelor's degree in a specified engineering or science field and a cumulative GPA of 3.0 or higher, with semiconductor packaging knowledge and analytical skills preferred. TI does not sponsor visas or work authorization for this position.
