Description
C12 is hiring a 3D Integration Engineer to develop advanced packaging and heterogeneous-integration technologies for scalable quantum-computing hardware. The role involves designing 2.5D and 3D integration architectures, interposers, TSVs, micro-bumps, hybrid bonds, redistribution layers, and chiplet interfaces; integrating quantum processors with cryogenic CMOS, RF/microwave, photonic, MEMS, and packaging systems; performing electrical, electromagnetic, mechanical, and thermal simulations; defining fabrication flows; developing test vehicles; and collaborating with cross-functional teams. The position is based in Paris and offers a yearly base salary of 60,000 to 78,000 euros.
