Description
Micron Technology is hiring an individual contributor for its Assembly Package Process Development team to develop, configure, optimize, and certify package assembly processes for memory products, including front-end, bonding, and back-end operations. The role involves process measurement and data interpretation, guideline development, system and process testing, change-control approvals, and collaboration with design and manufacturing teams. Candidates need 0–2 years of semiconductor manufacturing or packaging experience, a bachelor’s degree in a relevant engineering or science field, and hands-on experience with package assembly and wafer-level packaging; experience with TCB, CMP, ball mount, and HBM integration is preferred.
