Description
Synopsys is hiring a Distinguished Engineer, Advanced Packaging Solutions to lead package substrate design automation within the 3DIC Compiler platform. The role involves architecting and implementing production-grade algorithms for HDI substrate auto-routing, design rule checking, power delivery network analysis, and design for manufacturability; building scalable C/C++ software for multi-die chiplets and heterogeneous integration; partnering with customers and product teams; leading architecture reviews; and mentoring engineers. The position requires advanced packaging expertise, production software experience, strong algorithmic and C/C++ skills, an advanced degree or equivalent hands-on R&D experience, and a technical leadership record.
