Description
GlobalFoundries is hiring a Mechanical, Thermal, or Electrical Modeler/Engineer to support 3DHI and advanced packaging optimization across logic, RF, analog, and memory technologies. The role uses commercial simulation tools to model stress, thermal, and electrical performance; anticipate integration and process issues; and collaborate with device, integration, and design engineers. The position is based at the company’s 300mm fabrication facility in Malta, New York, and requires an M.S. with at least five years of relevant experience or a PhD with at least three years of relevant experience, along with semiconductor simulation and process knowledge.
