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Advanced Packaging Module Development Engineer at Intel

Compensation · Listed in posting

$133,800 – $255,200/yr

Location
Hillsboro, Oregon
Type
Full-time
Level
senior
Posted

Description

Intel is hiring a Process Integration Engineer for its Hillsboro, Oregon semiconductor campus. The role leads manufacturing process design, technology development, pathfinding, equipment optimization, supplier collaboration, feasibility studies, and data-driven process improvement using SPC, DOE, robotics, automation, vision systems, and image processing. Candidates need a relevant master's degree with 4+ years of experience or a PhD with 3+ years of experience, along with semiconductor processing or automation expertise. The position is on-site and offers an annual salary range of $133,800 to $255,200 USD.

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