Description
The High Performance Packaging Principle Integration Technologist will develop advanced packaging opportunity definitions, ecosystem engagement strategies, and programs from concept through proof of concept and transfer to high-volume manufacturing. The role combines equipment, process, and integration expertise across wafer-level packaging, hybrid bonding, fusion bonding, and related technologies with business-unit and ecosystem partners to identify challenges, define materials and solutions, and deliver industry-standard datasets. It requires an advanced engineering degree, extensive integration and 300mm process and equipment R&D experience, advanced packaging process development experience, and significant external business development experience.
