Description
Intel is hiring a Packaging Module Development Engineer for its Advanced Packaging Technology Manufacturing organization. The role develops, optimizes, and qualifies semiconductor packaging processes and equipment; designs experiments using SPC and DOE; collaborates with engineering, manufacturing, and product development teams; establishes materials and equipment specifications; documents technical findings; and leads standardization across global sites. The position requires an on-site presence in Phoenix, Arizona, offers a target annual salary of $115,110 to $219,550 USD, and is not eligible for immigration sponsorship.
