Description
GlobalFoundries is hiring an Advanced Packaging Process Integration Engineer in Burlington, Vermont, to lead post-Fab packaging process development for silicon photonics and other product lines. The role covers CMP, wafer thinning, dicing, bumping, RDL, wafer integration, assembly flows, failure analysis, process qualification, OSAT collaboration, and IP generation. Candidates need a PhD in a relevant engineering or materials science field and at least 15 years of related wafer-finishing and assembly experience; the expected salary is $143,000 to $247,000.
