Description
Intel is hiring a Process Integration and Yield Engineer for its NM Advanced Packaging team in Malaysia. The role focuses on integrating advanced packaging processes, analyzing yield and defect data, developing process control systems, designing experiments, and supporting technology ramp-up. Candidates need a relevant bachelor's degree with 4+ years of semiconductor process-integration experience, or a relevant master's degree with 3+ years of domain experience, or a relevant PhD with no prior professional experience. The position requires on-site work in Penang or Kulim, Malaysia, and is listed as an experienced hire.
