Description
Marvell is hiring an IC Packaging Engineer to evaluate package design feasibility, implement physical package designs, collaborate with electrical simulation, operations, and fabrication teams, and support layout, tool evaluation, flow development, and library maintenance. The role requires an Electrical Engineering degree and 1–5 years of related experience, familiarity with IC packaging and PCB layout tools, knowledge of advanced 2.5D/3D packaging technologies, and the ability to interpret electrical simulation results. The expected base pay is 152,700–203,600 RON per annum, with eligibility for bonus and equity plans.
