Advanced Packaging SI/PI Engineer at Etched

Department: Architecture

Compensation

$150,000 – $275,000/yr

Setup: On-site
Location: San Jose, California
Type: Full-time
Level: senior
Posted: Aug 27, 2026

Description

Etched is hiring a Signal & Power Integrity Engineer to ensure the electrical performance of its AI accelerator platform across silicon, package, and board. The role covers SI/PI analysis and optimization in 2D/2.5D/3D packages, high-speed routing, power delivery network design, decoupling, IR-drop and impedance analysis, ball/C4/BGA assignments, and rack-level scale-up studies. Candidates need a relevant engineering degree, at least 8 years of SI/PI experience on high-performance platforms, advanced-packaging expertise, and experience with tools such as ANSYS HFSS/SIwave, Cadence Sigrity, or Keysight ADS. The position is fully in-person in San Jose, with medical, dental, and vision benefits, a housing subsidy, relocation support, and other wellness benefits.

Required Skills

Signal integrity
Power integrity
PDN design
High-speed routing
ANSYS HFSS
Cadence Sigrity
Keysight ADS
Advanced packaging

Additional Information

Minimum Education: Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or a related field
Required Previous Experiences: 8+ years of SI/PI experience on high-performance ASIC, processor, or accelerator platforms
Experience defining and closing PDN for high-power silicon, including substrate and PCB plane design, decap strategy, and dynamic IR/EM analysis
Experience developing systems with high-speed HBM, SerDes, and D2D interfaces
Experience with CoWoS or equivalent advanced packaging, interposer SI/PI, C4 bump planning, and substrate stack-up trade-offs
Experience designing and correlating SI/PI test vehicles against silicon measurements during bring-up and lab characterization
Preferred Qualifications: Familiarity with RTL-to-GDSII and package and board PDN interactions
Experience with multi-die, 2.5D, or 3D packaging signoff and CPS co-design
Project management experience coordinating internal teams, OSAT partners, and PCB ODMs
Familiarity with modern ML, LLM, accelerator, or HPC architectures
Startup experience or comfort working in fast-paced environments
Translation Company Name: Etched

About Etched

Etched

AI hardware11-50

Etched is building a new category of AI hardware: frontier inference clusters, co-designing chips, racks, software, and manufacturing methods for frontier models. Etched says it has co-designed with leading AI companies, cloud providers, and hyperscalers, and tested racks in representative data center deployments. The company says its first racks ship this summer and production has started to fulfill over $1B in customer contracts.

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