Advanced Packaging Technology Development Process Integration Engineer at Intel

Compensation · Listed in posting

$115,110 – $219,550/yr

Location: Albuquerque, New Mexico
Type: Full-time
Level: mid
Posted: Sep 29, 2026

Description

Intel is hiring a Process Integration Engineer for its Advanced Packaging Technology & Manufacturing organization in Rio Rancho, New Mexico. The role develops and qualifies semiconductor packaging technology nodes, closes defect, yield, reliability, and device entitlement gaps, supports process readiness and technology transfer, and collaborates with device, yield, reliability, packaging, and other cross-functional teams. The position requires an on-site presence and offers an annual salary range of $115,110 to $219,550 USD.

Required Skills

Process integration
Yield analysis
Defect reduction
Process development
Advanced packaging
Cross-functional problem-solving

Additional Information

Minimum Education: Bachelor’s degree in engineering, material science, physics, or a related field with 3+ years of relevant experience; alternatively, a master’s degree with 2+ years of relevant experience, or a PhD with no prior experience required.
Required Previous Experiences: 3+ years of relevant experience for bachelor’s-degree candidates
2+ years of relevant experience for master’s-degree candidates
Relevant experience in technology development and/or high-volume manufacturing
Preferred Qualifications: 3+ years of experience
Leading cross-functional problem-solving initiatives in a complex, fast-paced environment
Advanced packaging technologies, including 2.5D, 3D IC, fan-out, or flip chip
Prior experience supporting technology transfer to high-volume manufacturing environments
Value engineering and an innovative mindset for cost-effective solutions
Translation Company Name: 100 Intel Corporation