Description
ZEISS is hiring a Field Application Engineer to optimize and validate 3D tomography FIB/SEM solutions for semiconductor laboratories and manufacturing facilities. The role provides customer-site technical support, coordinates technical meetings, conducts acceptance tests and demonstrations, troubleshoots application issues, and delivers application training. The primary customer assignment is in Yokkaichi, Mie Prefecture, with travel required to the United States, South Korea, and within Japan. The position is based at the Nagoya Sales Office, offers an indefinite contract, and pays ¥5.5 million–¥9 million annually, including bonus and allowances.
