Description
Micron Technology is hiring an Advanced Packaging Process Engineer to develop and qualify new packaging processes, materials, equipment, and technologies for advanced packaging products. The role leads process readiness, first qualification, risk mitigation, yield and reliability improvement, and the transition to small-volume production, while integrating upstream silicon and downstream packaging knowledge and collaborating with cross-functional teams. The position requires a relevant degree and eight years of semiconductor industry experience, including frontend or module process integration.
