Description
Broadcom is hiring an experienced IC Package Design Project Manager to lead a team of engineers designing complex flip-chip-BGA packages for ASICs used in AI, networking, HPC, and 5G applications. The role manages 20+ concurrent designs, schedules, resources, risks, customer and vendor activities, and technical methodologies, while contributing to package design, signal and power integrity, layout, simulation, automation, mechanical and thermal modeling, and project management. The position requires on-site work at the Broadcom office five days per week, occasional travel, and a bachelor's degree with 12+ years of related experience or a master's degree with 10+ years of related experience.
