Description
Lockheed Martin is hiring a Microelectronic Bonder in Chelmsford, Massachusetts to fabricate and modify hybrid microcircuits and sub-assemblies for defense systems. The role performs high-precision aluminum and gold wirebonding, troubleshoots defective hybrids, conducts electrical testing, and completes final assembly and thick-film operations. Candidates must have a high school diploma or GED, U.S. citizenship, and the ability to obtain and maintain a Secret security clearance. The position offers a full-time salary of $47,100 to $87,500 and medical, dental, vision, and other benefits.
