Description
Lockheed Martin is hiring a Microelectronic Bonder in Chelmsford, Massachusetts, for a weekend shift. The role fabricates and modifies hybrid microcircuits and sub-assemblies, including aluminum and gold wirebonding, troubleshooting defective hybrids, and performing final assembly and thick-film operations. Candidates need a high school diploma or GED, the ability to obtain and maintain a Secret security clearance, and familiarity with manual and automatic bonding equipment. The position offers a full-time salary of $47,100 to $87,500 and medical, dental, vision, and other benefits.
