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Assembler - Wire Bonder - 2nd Shift at Lockheed Martin

Department: MFC-Chelmsford

Compensation

$47,100 – $87,500/yr

Setup
On-site
Location
Chelmsford, Massachusetts
Type
Full-time
Level
not_specified
Posted

Description

Lockheed Martin is hiring a Microelectronic Bonder in Chelmsford, Massachusetts to fabricate and modify hybrid microcircuits and sub-assemblies, including aluminum and gold wirebonding, troubleshooting defective hybrids, and performing final assembly and thick-film operations. The role requires U.S. citizenship, the ability to obtain and maintain a Secret clearance, microelectronics assembly experience, and strong hand-eye coordination. The full-time position pays $47,100 to $87,500 and includes medical, dental, vision, flexible scheduling, retirement matching, paid time off, and other benefits.

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