Description
The role leads cost competitiveness, process efficiency, and bill-of-materials optimization across NXP’s semiconductor assembly operations. Responsibilities include QFN and leadframe cost transformation, high-density packaging, molding and mold-cost improvements, supplier collaboration, cross-functional business-line engagement, program governance, and change management. The position requires a bachelor’s or master’s degree in a relevant engineering field and 10–18+ years of semiconductor assembly or packaging engineering experience, along with expertise in cost modeling, qualification processes, and global program leadership.
