Description
The Semiconductor Packaging Engineer will collaborate with OSAT, the Division, and R&D teams on new product development and production. Responsibilities include deploying technical requirements to subcontractors, defining critical process characteristics, improving yield and processes, supporting package maturity and automotive readiness, developing technical systems and templates, deploying ST technical projects, managing change, and benchmarking packaging roadmaps. The role requires a bachelor's degree or higher, more than eight years of semiconductor experience, proficiency in semiconductor assembly processes, and experience with APQP, SPC, FMEA, DOE, 8D, statistical analysis, project management, complex technical problem solving, and Microsoft software.
