Description
Renesas is hiring a Semiconductor Packaging Development Engineer at its Yamanashi factory to lead new-product development projects for automotive and IoT high-reliability packages. The role includes technical support and reporting, manufacturing-line setup and mass-production transition, quality and yield improvement, new materials and process development, and technical collaboration with overseas sites. The position requires at least two years of semiconductor packaging development experience, reliability testing knowledge, process improvement and quality management experience, and a technical degree.
