AMD is seeking a highly motivated and creative individual to join their Bump Engineering team. The successful candidate will be responsible for improving the yield, quality, cost, and productivity of bump, interposer, and fan-out RDL processes. They will also handle mask validation, packaging interaction, and managing supplier performance. This role involves working collaboratively with packaging teams and driving continuous improvement initiatives.
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AMD delivers leadership high-performance and adaptive computing solutions to advance data center AI, AI PCs, intelligent edge devices, gaming, & beyond.