Description
Texas Instruments is hiring a Packaging Engineer to design, develop, and analyze semiconductor packaging technologies for analog and embedded processing products. The role partners with business and cross-functional teams on packaging solutions, product qualification, reliability, yield, design testability, materials selection, and electrical, mechanical, and thermal modeling. Candidates need a bachelor's degree in a relevant engineering or science field and a cumulative GPA of 3.0 or higher; semiconductor packaging knowledge, analytical skills, communication, teamwork, and project-management abilities are preferred. The position does not offer visa sponsorship.
