Description
Micron Technology is hiring an Equipment Engineer to support CMP and advanced Bonding processes in semiconductor manufacturing. The role leads the startup and qualification of new equipment, develops and characterizes hardware and process solutions, oversees installations and upgrades, collaborates with suppliers, maintains equipment documentation, supports audits, and uses AI and data analysis to improve operational efficiency. Candidates need semiconductor or manufacturing equipment/facilities experience, strong analytical and communication skills, cleanroom work experience, Japanese fluency, and basic English communication skills.
