Description
NXP is seeking a CMP Equipment Engineer to support and improve chemical mechanical polishing equipment in a high-volume wafer fabrication environment. The role focuses on equipment reliability, uptime, maintenance, troubleshooting, root-cause analysis, vendor coordination, tool qualifications, and preventive and predictive maintenance. It also partners with Process Engineering, Manufacturing, Facilities, and Equipment Vendors to drive yield, quality, cycle time, cost, and manufacturing efficiency improvements. The position requires a bachelor's degree in an engineering discipline and 2–5 years of semiconductor manufacturing experience, preferably in CMP equipment engineering.
