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College Intern - Job Description Metrology, Defect Inspection, and Data Analytics for Die-to-Wafer Hybrid Bonding at Applied Materials

Department: Interns

Language
Setup
On-site
Location
Sgurgola, Lazio
Type
Full-time, Internship
Level
intern
Posted

Description

Applied Materials is hiring a full-time intern in Singapore to support the development and validation of overlay metrology and defect inspection applications for a die-to-wafer hybrid bonding cluster system. The role involves engineering data analysis, image processing, software utility development, measurement and inspection data evaluation, defect characterization, technical reporting, and collaboration with cross-functional engineering teams.

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