Description
HP is hiring a College Intern - Process and Digitalization to design and develop practical manufacturing solutions using AI, IIoT, smart vision systems, robotics, and automation technologies. The intern will work with semiconductor packaging equipment, improve equipment performance and process capability, contribute to production improvement, sustainability, and new product introduction projects, and use problem-solving, experimentation, data analysis, and engineering studies to validate improved manufacturing processes. The role requires a relevant bachelor’s or master’s degree, a five- to six-month full-time internship beginning in January 2027, and knowledge or project experience in automation, robotics, machine vision, AI, machine learning, IIoT, data analytics, digitalization, or software programming.
