Description
Lumilens is hiring a hands-on Component Process Engineer to serve as the primary substrate engineering interface between hardware design, package manufacturing, and worldwide substrate suppliers. The role focuses on FR4 substrate and PCB development, mSAP/HDI/Any-Layer process development, supplier qualification, DFM/DFT/DFR, quality control, failure analysis, reliability testing, and cross-functional process development through SMT, die attach, wire bonding, active alignment, and testing. Candidates need a B.S. or M.S. in Material, Chemistry, or Mechanical Engineering, at least 8 years of FR4 substrate or PCB development or manufacturing experience, familiarity with relevant tools and methodologies, and 30–50% travel to Asian countries.
