Description
The role analyzes complex datasets related to EVG equipment, with a focus on overlay-related analyses for wafer bonding. Responsibilities include interpreting data, supporting experiment planning, presenting visualizations, coordinating with on-site teams and customers, and developing new analysis methods. The position requires a university degree in data science or a related field, programming skills in Matlab and Python, statistical analysis and data visualization experience, mathematical modeling skills, and very good English. The stated annual gross salary is at least EUR 49,700, with the possibility of higher pay depending on qualifications and experience.
