Design Architecture, Principal Engineer at Micron

Department: DTPG

Language

Setup: On-site
Location: Taiwan · Taichung
Level: staff+
Posted: Aug 10, 2026

Description

Micron Technology is seeking a Principal Engineer for HBM Design Architecture to explore and define next-generation AI memory and system environments. The role involves researching compute, networking, and storage trends; leading HBM architecture analysis; developing and validating simulation frameworks and first-order performance models; creating trend dashboards; and collaborating with architects and senior engineers across DTPCO, Design, and Product/System teams to translate AI workload requirements into memory subsystem and architectural strategies.

Required Skills

HBM architecture
Performance modeling
Simulation frameworks
Memory subsystem design
AI/ML workloads
Microelectronic manufacturing

Additional Information

Minimum Education: Bachelor’s or Master’s degree in Electrical Engineering, Materials Science or related field (or equivalent practical experience).
Required Previous Experiences: Experience with memory subsystem design involving HBM, DDR, and caches.
Strong multi-disciplinary experience in the Fab and Foundry space.
Preferred Qualifications: Exposure to electrical and materials challenges and advances in microelectronic manufacturing, including compute, memory, and interconnects.
Ability to translate research and model outputs into concise technical recommendations, including trade-off discussions, risks, and roadmap implications.