Description
The employer is seeking a Development Engineer for Adhesive Bonding Technology in Oberkochen to develop adhesive bonding technologies for optomechanical assemblies used in semiconductor manufacturing. The role covers adhesive selection and qualification, application and pre-treatment processes, series-production introduction, process validation, technical coordination with customers and suppliers, and requirements definition. It is a full-time temporary employee-leasing assignment initially limited to 24 months, with possible permanent employment after good performance, and offers an immediate start, a salary of €85,000 per year, and a 35-hour workweek.
