Description
Lumilens is hiring a mid-to-senior level Die Attach Manufacturing Engineer – Process & Equipment to lead the development, qualification, optimization, and sustaining of die attach processes and equipment for silicon photonics, PICs, laser dies, and co-packaged optical/electronic modules. The role covers active/passive alignment bonding, epoxy and AuSn/eutectic attach, flip-chip bonding, sub-micron placement accuracy, optical coupling yield, reliability testing, NPI, equipment qualification and uptime, and cross-functional manufacturing improvement. Candidates need a bachelor’s degree in a relevant engineering field, 3–7 years of silicon photonics or PIC packaging experience, and direct experience with optically sensitive die handling and high-precision die attach equipment.
