Description
GlobalFoundries is hiring a Director-level Advanced Package Assembly and Test Engineering leader based in Taiwan to build and lead a team of 5 to 6 advanced package assembly and test engineers. The role serves as the primary technical, operational, and business interface with a Taiwan-based supplier, leading advanced packaging development, NPI, qualification, reliability, yield improvement, failure analysis, manufacturing readiness, supplier execution, customer engagement, and cross-functional program alignment. The position requires extensive semiconductor packaging and advanced manufacturing experience, people leadership, supplier development, customer relationship management, and strong technical knowledge of advanced packaging technologies.
