Description
Applied Materials is hiring a Director of Advanced Packaging Technology to define long-range pathfinding strategies for N+2 and beyond, lead exploratory technologies such as D2W, RDL, CoWoS, and TSV, and translate customer and market needs into differentiated packaging solutions. The role builds and leads a high-impact innovation team, develops strategic partnerships, establishes program governance, and bridges technology, customer, and business units. It requires 15+ years of semiconductor technology experience, advanced packaging expertise, and leadership in cross-functional R&D teams, with a Singapore work location and approximately 20% travel.
